@article{oai:toyama.repo.nii.ac.jp:00006505,
 author = {田口, 明 and 広見, 千賀子 and 谷澤, 昌昭 and 北見, 知士 and 赤丸, 悟士 and 阿部, 孝之},
 journal = {富山大学水素同位体科学研究センター研究報告 = Annual Report of Hydrogen Isotope Research Center, Toyama University},
 month = {},
 note = {application/pdf, Total sputtering yield, defined as the ratio of the amount of metal deposited on a powdery substrate and the total amount of metal sputter-deposited, was investigated from Au modification of glass plates and PMMA polymer particles by using barrel-sputtering technique. The dependence of the angle distribution of Au deposition on RF input power was studied in the beginning. The amount of Au deposition was found to linearly depend on the distance from the center of the barrel, and the total amount of Au deposition was also found to linearly depend on the bias voltage for sputtering performed. On the basis of the amount of Au deposited on the PMMA polymer particle and the total amount of Au sputter-deposited, it was concluded that the total sputtering yield for Au modification of PMMA polymer particles was ca. 11 %., Article},
 pages = {45--50},
 title = {バレルスパッタリング法によるPMMAポリマー粉末表面へのAu修飾における修飾効率の検討},
 volume = {26},
 year = {2006}
}