{"created":"2023-07-25T09:05:06.522018+00:00","id":3096,"links":{},"metadata":{"_buckets":{"deposit":"a009c907-953b-4176-ad65-9b87c2fbdcc1"},"_deposit":{"created_by":3,"id":"3096","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"3096"},"status":"published"},"_oai":{"id":"oai:toyama.repo.nii.ac.jp:00003096","sets":["496:556:557:558"]},"author_link":["10231","10227","10228","10220","10230"],"item_2_alternative_title_19":{"attribute_name":"その他（別言語等）のタイトル","attribute_value_mlt":[{"subitem_alternative_title":"Cooling Unit for Computer Chip by Using Boiling Heat Transfer : Evaluation of Basic Cooling Performance and Simulation for Predicting Cooling Performance"}]},"item_2_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2006-06","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"718","bibliographicPageEnd":"11","bibliographicPageStart":"4","bibliographicVolumeNumber":"72","bibliographic_titles":[{"bibliographic_title":"日本機械学會論文集. B編 = Transactions of the Japan Society of Mechanical Engineers. B"}]}]},"item_2_description_15":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_2_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"In recent years, the heating value of CPU has been increasing rapidly with the improvement of computer performance. Therefore computer industry is requiring cooling unit with high cooling performance for CPU in applicable to high heating value and heat flux. The existing cooling unit for CPU has been air-cooling aluminum fin, however it can not be adaptable to high heating value. We have developed a new compact boiling refriberant type cooling unit for CPU. In this paper, the basic cooling performance of this boiling refrigerant type cooling unit was evaluated, it was clarified that the boiling refrigerant type cooling unit has high cooling performance compared with conventional air cooling aluminum fin. Furthermore the calculation method for predicting the cooling performance by modeling boiling and condensing phenomena was proposed.","subitem_description_type":"Abstract"}]},"item_2_description_40":{"attribute_name":"資源タイプ(DSpace)","attribute_value_mlt":[{"subitem_description":"Article","subitem_description_type":"Other"}]},"item_2_description_5":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"relation: isVersionOf: http://ci.nii.ac.jp/naid/110004758277/","subitem_description_type":"Other"}]},"item_2_full_name_3":{"attribute_name":"著者別名","attribute_value_mlt":[{"nameIdentifiers":[{"nameIdentifier":"10220","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"9000003727928","nameIdentifierScheme":"CiNii ID","nameIdentifierURI":"http://ci.nii.ac.jp/nrid/9000003727928"}],"names":[{"name":"Kawaguchi, Kiyoshi"}]},{"nameIdentifiers":[{"nameIdentifier":"10230","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Terao, Tadayoshi"}]},{"nameIdentifiers":[{"nameIdentifier":"10231","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Matsumoto, Tatsuhito"}]}]},"item_2_publisher_33":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"社団法人日本機械学会"}]},"item_2_source_id_10":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN00187441","subitem_source_identifier_type":"NCID"}]},"item_2_source_id_8":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"03875016","subitem_source_identifier_type":"ISSN"}]},"item_2_version_type_16":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"川口, 清司"}],"nameIdentifiers":[{},{}]},{"creatorNames":[{"creatorName":"寺尾, 公良"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"松本, 達人"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2016-02-16"}],"displaytype":"detail","filename":"機械論文B-06Kawag.pdf","filesize":[{"value":"1.0 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"機械論文B-06Kawag.pdf","url":"https://toyama.repo.nii.ac.jp/record/3096/files/機械論文B-06Kawag.pdf"},"version_id":"0013c968-c480-4254-ba91-d5229f43f4f5"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Heat Transfer","subitem_subject_scheme":"Other"},{"subitem_subject":"Thermosyphon","subitem_subject_scheme":"Other"},{"subitem_subject":"Boiling","subitem_subject_scheme":"Other"},{"subitem_subject":"Condensation","subitem_subject_scheme":"Other"},{"subitem_subject":"Cooling Unit","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"沸騰冷却を用いたコンピュータチップ用冷却器 : 基本性能評価と計算による性能予測","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"沸騰冷却を用いたコンピュータチップ用冷却器 : 基本性能評価と計算による性能予測"}]},"item_type_id":"2","owner":"3","path":["558"],"pubdate":{"attribute_name":"公開日","attribute_value":"2007-12-12"},"publish_date":"2007-12-12","publish_status":"0","recid":"3096","relation_version_is_last":true,"title":["沸騰冷却を用いたコンピュータチップ用冷却器 : 基本性能評価と計算による性能予測"],"weko_creator_id":"3","weko_shared_id":3},"updated":"2023-07-25T13:59:12.403494+00:00"}